Methods and low-cost single and multiply-detector IR heads for thermal management of electronics and microelectronics systems, circuits and devices

The measurement stand with MWIR single-detector head to measure thermal impedance of an electronic system

Introduction

Elevated temperature is the dominant cause of electronic systems failures, accounting for 55% of them. Thus, there is a need for thermal characterization of electronic circuits. One of main methods of describing their thermal properties is the thermal impedance approach. The mathematical foundations for such measurements were laid down in the JEDEC JESD51 standards series. A system for thermal impedance measurements using a fast, single detector IR sensor was designed and tested, along with dedicated software for thermal characterization of electronic circuits, based on upper surface temperature measurement.

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Gas detection and monitoring using uncooled bolometer cameras

Gas detection and monitoring using uncooled bolometer cameras

Introduction

Explosive and poisoned gases leakage causes the danger for people both in industry and at home. The example is the methane in coal mines. The imaging systems presenting the distribution of gas concentration from a distance is the alternative for widely-used single detector sensors. Moreover, due to the warming effect, climate changes and environment protection, there is a growing interest of using remote gas imaging systems. We do both the research and developments in this field. As the example, the high-sensitive bolometer cameras we have successfully used for detection methane, ammonia and carbon dioxide (CH4, NH3, and CO2)

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Application of lock-in methods for measuring radiation temperature

Application of lock-in methods for measuring radiation temperature

Introduction

For years, radiation temperature measurement was the classical application of IR thermography. Nowadays, we observe new, the unconventional use of this technique in numerous domains for indirect process monitoring and measurement. One of the example of such application is the RMS electrical current measurement in outdoor power cables with eliminated effect of convective cooling and solar radiation. Furthermore, there is a need of measuring distributions of temperature changes at the very low level, below the noise limits of today’s IR systems.

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NIR Raman scattering system for distributed temperature sensing with low-power long distance laser excitations

NIR Raman scattering system for distributed temperature sensing with low-power long distance laser excitations

Introduction

Fiber optics are used as various sensors of different physical quantities for years. Distributed measurement systems are ones of the very promising applications of fiber optics today. Huge interest of fiber optics results from the amount of valuable information optical fibers can deliver. The environmental changes around the optical fiber cause changes of the optical fibers’ parameters, such as attenuation, dispersion, refractive index and light scattering. Optical fiber-based measurements systems are becoming popular due to the low cost, immunity to electromagnetic interferences, durability and high sensitivity. Distributed Optical Fiber Sensors (DOFS) are mainly based on the light scattering phenomena. Light scattering in optical fibers is basically caused by the interaction between photons and medium particles. Light scatters in every direction and can be enhanced by exterior factors such as strain and temperature. There are two major types of light scattering: elastic and inelastic ones. In the elastic scattering, the frequency of incident and the frequency of the scattered photons are equal, while in the inelastic scattering the frequency of the scattered photons is shifted to lower (Stokes) or higher (Anti-Stokes) frequencies. These shifts are equal to the characteristic vibration frequencies of the molecules. Rayleigh scattering is the elastic scattering phenomenon that results from the irregularity of the molecular structure, and it has the high impact on optical fiber’s attenuation. Brillouin scattering is the inelastic scattering that occurs due to strain or thermally excited acoustic waves. Raman scattering is also the inelastic scattering and it is enhanced by temperature-dependent molecular vibrations. DOFS are capable of measuring the appropriate quantity along the optical fiber at distance of tens of kilometers. Nowadays, the measurements of strain, temperature, oil and gas leaks and fire detection are being applied in DOFS systems. Optical fibers can be used in optical transmission lines monitoring, structures’ health monitoring, pipeline monitoring, hydrology, nuclear industry and mining.

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Development and thermography measurements of modern heat sinks using phase change materials for electronics cooling

Development and thermography measurements of modern heat sinks using phase change materials for electronics cooling

Introduction

Thermal management is one of the most important issues for electronic devices producers. The market of electronic devices grows very fast as well as power densities dissipated in electronic components. Dimensions of the devices and their packages are getting smaller. Electronic devices are operating well in specified range of temperature. Overheating of electronic elements leads to their shorter lifetime, malfunction (e.g. logic errors in microprocessors) or even immediate breakdown. As the result of above pointed facts, there is a need to design and produce advanced cooling systems that would fulfil the thermal management requirements in a superior way.

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Institute Structure – Divisions

Medical Electronics Division

Head of the Division
prof. Piotr Szczypiński


Communications Division

Head of the Division
prof. Sławomir Hausman


Electronic Circuits and Thermography Division

Head of the Division
prof. Bogusław Więcek

Address

Institute of Electronics
Lodz University of Technology
Al. Politechniki 10, B-9 building
93-590 Lodz, POLAND


Correspondence address

116 Żeromskiego Str.
PL 90-924 Lodz
POLAND

VAT identification number: PL 727-002-18-95